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China’s current situation
Posted on January 7th, 2010 No commentsChina’s current situation
In recent years, lead-acid canon bg-e6 battery grip technology continues to develop, products matured. Structure has gradually starting canon eos 20d battery grip optimization and upgrading, maintenance-free batteries widely used, is still military, civilian transportation equipment, an important power supply devices, for our country become the world’s major automobile-producing countries play an important supportive role.
VRLA batteries, gel batteries as a backup power supply, large reserves of power core components, its production has become an important foundation for economic development in the sex industry. Promising lead-acid vgp-bps2 , vgp-bps2a battery industry.
The main raw material for lead-acid batteries – lead-recyclable repeated use, as long as the introduction of waste battery recycling related industrial policies, the right to guide the market, we can effectively solve the shortage of China’s non-ferrous metals, lead pollution, resources and the environment many problems. Therefore, a correct understanding of storage vgp-bps2b , vgp-bps2c battery industry, the status quo, identify trends and effectively resolve their own problems, is the recycling of resources and building a conservation-oriented society, is an effective way of scientific development to the national economy.
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Sensor: MEMS integrated with IC tends to spread the high-end(B)
Posted on November 18th, 2009 No commentsSensor: MEMS integrated with IC tends to spread the high-end(B)
For the future, sensors will be integrated with IC, Pang Chuan need to see that this is not necessary, high integration is good Sony vgp bps2c battery, but the market demand for diversified, and therefore could be flexible about. “For example, the supply of A and B sensor chip integration, but I might want is A mix of sensors and C films, it would have to respectively.” Pang Chuan said.
MEMS sensors first in the high-end universal
The sensor and IC integration of MEMS technology sony battery VGP-BPS2A lies. Pang Chuan said, MEMS technology is a sensor processing technology, many new types of sensors will be designed for such processing. Pangchuan introduction, MEMS technology will be popular in high-end applications, at present apart from pressure sensors, flow sensors and other sensors using MEMS technology, an increasing number of magnetic sensors using MEMS devices are also increasing. The most recent hot spots is the oxygen sensor, the original function is only near the air-fuel ratio measuring the value of reason, the current hot spot is a wide range of air-fuel ratio measurement, which need to adopt some new technology.
He also said that the high-end sensors using MEMS technology, more and more, as low-end products, there is no need to change the original design.
Packaging technology is essential Sony VGP-BPS8 Battery
However, IC integration of MEMS sensors and sensor architecture is not “foolproof.” To industry sources, it brings the reliability worries, how to ensure that any load, temperature and vibration conditions of stability and reliability is a problem, in addition to continuing to reduce costs are also faced with many challenges. “Thus, the use of MEMS technology to produce the sensing element, technically have to consider three aspects: First, the structural design must be reasonable; second pass processing technology; third is packaging technology.” Pang Chuan said.
As for the packaging industry have different views on Freescale stakeholders introduced used for Sony VGP-BPS9 Battery vehicle dynamic control and airbag accelerometers challenge is the user want to integrate the sensor and controller IC can have a smaller package. Because all the functions can not be integrated in a silicon chip, so need to be stacked die in order to optimize the process. From the packaging point of view to examine the sensor, it will not be placed on a silicon wafer, but on two points on the processor and the sensor chip. But there are also companies that provide a simplified single silicon package programs will be an advantage. True single-chip program will be G sensor (accelerometer), temperature sensors or flow sensors and signal processing components on the same piece of silicon, which can achieve a minimum of space.
Freescale also said that the future of sensors and other applications are vgp bps2c likely to include more gyroscope-based devices. The MEMS gyroscope will be based on NP-20, the increase as the production, MEMS processing costs will be down.